Kepler Computing has unveiled a new chip design approach aimed at addressing the global memory shortage. The startup claims its proprietary 3D stacking technique and novel materials can enhance memory density without relying on costly extreme ultraviolet lithography, potentially allowing for production within existing semiconductor facilities.
With significant backing, including a $245 million commitment from the US Department of Commerce, Kepler is currently testing its technology in Singapore. The company plans to ship its first high-bandwidth memory (HBM) samples later this year, with production ramping up in 2024 and US manufacturing expected by 2028.
Kepler's innovative memory chip technology could reshape data center architectures, especially with AI demands. As they prepare for HBM sample shipments, watch for partnerships with major tech firms and potential shifts in memory supply chains as production ramps up in 2024.